| Wafer positioning stage – XY axis (OPAL-EC-300) | Travel range: 300 mm; Resolution: 0.003 μm; Accuracy: 0.75 μm; Bi-directional repeatability: 0.1 μm; Maximum process speed: 100 mm/s; Orthogonality: 1 arcsec; Motor type: Direct-drive linear motors, noncontact encoder |
| Wafer positioning stage – Z axis (height) | Travel range: 5 mm; Resolution: 0.0008 μm; Accuracy: 1.5 μm; Bi-directional repeatability: 0.3 μm; Maximum speed: 4 mm/s; Motor type: Direct-drive brushless linear motor |
| Wafer positioning stage – Rz axis (wafer rotation) | Travel range: 105°; Resolution: 0.36 arcsec; 0.0001°; Accuracy: 80 arcsec; 0.02°; Repeatability: 3 arcsec; 0.0008°; Maximum speed: 600 rpm; Motor type: Direct-drive brushless rotary motor, mechanical bearing |
| Chuck options | TA-G: Range (°C) (ambient); 300-mm round chuck with 4 concentric vacuum zones; Electrical surface: grounded TH5-G: Range (°C) 0 - 150; Resolution (°C) 0.01; Stability (°C) ±0.05 (> 25) and ±0.1 (< 25); Heating rate: 40 °C/min; Cooling rate: –5 °C/min; Surface flatness: < 25 μm; 300-mm round chuck with 4 concentric vacuum zones; Electrical surface: grounded TH5-F: Range (°C) 0 - 150; Resolution (°C) 0.01; Stability (°C) ±0.05 (> 25) and ±0.1 (< 25); Heating rate: 40 °C/min; Cooling rate: –5 °C/min; Surface flatness: < 25 μm; 300-mm round chuck with 4 concentric vacuum zones; Electrical surface: floating coaxial (triaxial as option) |
| Top vision system – mechanical base holder | Mounting: Compatible with metric and imperial optical breadboard, at 90° and 45°; X, Y, Z axis travel range: 48 mm; X, Y axis displacement/revolution: 1.41 mm; Z axis displacement/revolution: 0.3175 mm |
| Top vision system – vision | Magnification: 10 X; Numerical aperture: 0.28; Depth of field: 3.6 μm; Horizontal field of view: 0.88 mm; Working distance: 34 mm; Resolution: 2.9 MP; Maximum frame rate: 144 fps; Sensor format: 2/3 inch; Sensor type: Color, global shutter, 12 bit; Wavelength: visible; Illumination type: In-line through video microscope unit, LED illuminator |
| Side vision system – mechanical base holder | Mechanical positioning: 6D manual coarse adjustment with articulated arm, XY manual translation stage; Mounting: Compatible with metric and imperial optical breadboard, at 90° and 45°; X, Y axis travel range: 48 mm; X, Y axis displacement/revolution: 1.41 mm |
| Side vision system – vision | Lens type: telecentric; Magnification (X): 3; Numerical aperture: 0.093; Field of view: 2.9 × 2.2 mm; Working distance: 65 mm; Wavelength range: visible; Resolution: 2.9 MP; Maximum frame rate: 144 fps; Sensor format: 2/3 inch; Sensor type: Color, 12 bit, global shutter; Wavelength: visible |
| Optical head options (PRO-H / PRO-S / PRO-ECO) | Motorized axes: X, Y, Z, Rx, Ry, Rz (for all options, with configuration-dependent details) Configuration: PRO-H – parallel hexapod, piezo; PRO-S – serial stack, DC servo; PRO-ECO – serial stack, screw X axis travel (mm): PRO-H 20; PRO-S 25; PRO-ECO 25 Y axis travel (mm): PRO-H 11; PRO-S 25; PRO-ECO 25 Z axis travel (mm): PRO-H 20; PRO-S 4.8; PRO-ECO 12.5 X axis resolution (nm): PRO-H 1; PRO-S 10; PRO-ECO 200 Y axis resolution (nm): PRO-H 1; PRO-S 10; PRO-ECO 200 Z axis resolution (nm): PRO-H 1; PRO-S 60; PRO-ECO 25 X axis repeatability (nm): PRO-H unidirectional 50, bidirectional 70; PRO-S bidirectional 1250; PRO-ECO bidirectional 1250 Y axis repeatability (nm): PRO-H unidirectional 50, bidirectional 70; PRO-S bidirectional 1250; PRO-ECO bidirectional 1250 Z axis repeatability (nm): PRO-H unidirectional 50, bidirectional 250; PRO-S bidirectional 125; PRO-ECO bidirectional 125 Rx axis travel (°): PRO-H 23; PRO-S 10; PRO-ECO 10 Ry axis travel (°): PRO-H 38; PRO-S 10; PRO-ECO 10 Rz axis travel (°): PRO-H 26; PRO-S 10; PRO-ECO 10 Rx, Ry, Rz axis resolution (arcsec): PRO-H 0.04; PRO-S 4; PRO-ECO 4 Rx, Ry, Rz axis repeatability (arcsec): PRO-H unidirectional 1.5; PRO-S 7; PRO-ECO 7 Full virtual pivot point: PRO-H yes; PRO-S no; PRO-ECO no Orientations: North/East/South/West (all options); Included: fiber holder (all options) |
| Electrical head options (PRE-00 / PRE-MO) | Translation stages type: PRE-00 manual; PRE-MO motorized X, Y, Z with manual probe angle X, Y axis travel range (mm): PRE-00 48; PRE-MO 50 Z axis travel range (mm): PRE-00 48; PRE-MO 25 X, Y, Z axis resolution (nm): PRE-MO 100 X, Y, Z axis repeatability (μm): PRE-MO 1, bidirectional, typical 0.3 X, Y, Z axis accuracy (μm): PRE-00 typical 2; PRE-MO 5 X, Y, Z axis speed (mm/s): PRE-MO 5 X, Y, Z axis displacement/revolution (mm/rev): PRE-00 0.3 Tilt travel: 10° (both options); Rail system × travel: PRE-00 180 mm; PRE-MO 160 mm; Z coarse step travel (mm): PRE-00 min 6.35, max 56; PRE-MO min 12.5, max 100 |
| a. Other temperature ranges available upon request. b. Other electrical surface options available upon request. a. Optical probes (fiber array, fiber) and electrical probes (DC, RF) are not included in the system. If these components are required, please contact an EXFO representative. a. Other magnifications options (0.5X, 1X, 2X, 4X, 6X, 8X) available upon request. b. Other working distances options (40 mm, 110 mm) available upon request. a. Other optical options and configurations are available upon request. b. Various configurations are available. X, Y, Z are always motorized and angles can be motorized, up to all 6 axes. Specifications here are for all motorized axes, travel may differ for manual version. c. Multiple options are available for surface and edge coupling configuration, multiple angles available. | |
| Device under test (DUT) | Single die up to 12-in wafer |
| Work area (OPAL-EC) | Ф300 mm |
| Coupling mode | Surface and edge coupling |
| Alignment | Full automated |
| Chuck (OPAL-EC in OPAL series overview) | Ambient or 0 °C to 200 °C (32 °F to 392 °F); 4 vacuum zones |
| Rotation base stage (OPAL-EC in OPAL series overview) | Motorized rotation: 105° |
| Probe configuration | Optical and electric probes, up to 4 |
| Compatible wafer size | Up to 12 in (300 mm) wafers; also suitable for single dies, bars and multiple dies using adapter plates |
| OPAL-EC main system – chuck | Aluminum surface, ground polished, ambient temperature, chuck with 4 vacuum zones; electrical surface connection options; thermally controlled chuck with heating and cooling capabilities, range from 0 °C to 150 °C, 4 vacuum zones |
| OPAL-EC main system – wafer positioning base stage | High accuracy, 4° of freedom wafer positioning with possibility to rotate a wafer by 105°; 300 mm (12-in) diameter chuck and XY travel range |
| OPAL-EC main system – vision system | Top high-resolution video system with 10X magnification using in-line coaxial illumination and 2.9 MP color camera on XYZ manual adjustment; side view 2.9 MP color camera with 3X telecentric magnification on XY manual adjustment |
| Additional accessories | Industrial rackmount PC and accessories (KMV), two 27-in monitors; free-standing workstation; top enclosure |
| EXFO Pilot software – dedicated license | Full software suite for complete test and measurement flow of PIC; automation and control of test station, instruments and data for absolute traceability and reliability of results that are report-ready and AI-ready; additional floating licenses available for multi-user collaboration from anywhere |
| Electrical probes (general description) | 4-axis manual electrical probe positioners for fine alignment and long travel range; probe holders compatible with most DC and RF probes (PRE-00 manual, PRE-MO motorized with 200 nm resolution) |
| Optical probes (general description) | Motorized 6-axis nanometer-precision, piezo-based hexapod for precise and fast operation for edge coupling and surface coupling; features virtual pivot point for optimization of injection angle during automated coupling; includes a clamp to fit most fiber arrays and a slider/manual screws concept to toggle between engaged/disengaged positions |
| a. Optical probes (fiber array, fiber) and electrical probes (DC, RF) are not included in the system. If these components are required, please contact an EXFO representative. | |