OPAL-MD - Multi-die automated test station

概述
Accurate, automated, fast testing of photonic integrated circuits (PIC) with traceable results.

主要优点

  • Multi-die PIC characterization in one single execution
  • Flexible design with reconfigurable probes
  • Single software suite for preparation, execution and analysis of PIC test data
  • Operates with EXFO optical component tester and other test equipment
  • Ultra-precise optical heads – ideal for surface and edge-coupling
  • Precise DC and RF probing positioners

应用

  • Optical and electrical probing and testing of integrated photonics on multiple dies
  • Opto-electronic testing on any integrated photonic platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous, etc.
  • Application-agnostic: telecom & datacom transceivers, quantum, LIDAR, sensors, AI, etc.
  • Pilot production
  • Design and process validation
  • MPW die verification