OPAL-EC - Advanced wafer-level edge-coupling testing station

Accurate, flexible, fast testing of photonic integrated circuits (PIC) with traceable results.

Características principales

Complete PIC testing platform for precise and repeatable optical alignment and electrical probing.

Preparation, automated execution (navigation, alignment, instrument control) and data management (repository, analysis) with the included EXFO Pilot software suite.

Different probe head options, as needed: Optical head models with up to 6 motorized axes for surface- and edge-coupling with single fibers or fiber arrays; Electrical heads with manual or motorized axes.

Best-in-class repeatability of optical probe heads and base motion systems.

Industry first multiport edge-coupling testing at wafer level.

Wafer, stretch-tape, multiple dies or bar testing with the same station.

Flexible design with repositionable optical and RF/DC probes.

Compatible with wafers of up to 12 inches (300 mm).

Aplicaciones

From R&D, design verification and process development to early production and manufacturing

Opto-electronic testing on integrated photonics platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous

In-depth analysis of statistical circuit performance and yield

DUT-agnostic: can test singulated dies (single to tens), reticles, custom cuts, bars, 12-inch wafers

Application-agnostic: telecom and datacom transceivers, quantum, LIDAR, sensors, AI for surface- and edge-coupling with single fiber or fiber-array to prototyping and PILOT production