OPAL-EC - Advanced wafer-level edge-coupling testing station

Resumen
Accurate, flexible, fast testing of photonic integrated circuits (PIC) with traceable results.

Características principales

  • Complete PIC testing platform for precise and repeatable optical alignment and electrical probing. 
  • Preparation, automated execution (navigation, alignment, instrument control) and data management (repository, analysis) with the included EXFO Pilot software suite. 
  • Different probe head options, as needed: Optical head models with up to 6 motorized axes for surface- and edge-coupling with single fibers or fiber arrays; Electrical heads with manual or motorized axes. 
  • Best-in-class repeatability of optical probe heads and base motion systems. 
  • Industry first multiport edge-coupling testing at wafer level. 
  • Wafer, stretch-tape, multiple dies or bar testing with the same station. 

Aplicaciones

  • From R&D, design verification and process development to early production and manufacturing
  • Opto-electronic testing on integrated photonics platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous
  • In-depth analysis of statistical circuit performance and yield
  • DUT-agnostic: can test singulated dies (single to tens), reticles, custom cuts, bars, 12-inch wafers
  • Application-agnostic: telecom and datacom transceivers, quantum, LIDAR, sensors, AI for surface- and edge-coupling with single fiber or fiber-array to prototyping and PILOT production

Recursos

Hoja de especificaciones

OPAL-EC: edge-coupling wafer-level test station
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